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OpenAI says its new o3 and o4-mini AI models hallucinate more often than its previous reasoning and traditional models, and the company doesn't know why (Maxwell Zeff/TechCrunch)

Maxwell Zeff / TechCrunch : OpenAI says its new o3 and o4-mini AI models hallucinate more often than its previous reasoning and tradition...

15 April 2025

Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as "panel-level", to meet rising demand for powerful AI chips (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia:
Sources: TSMC is close to finalizing specs for a new chip packaging method, known in the industry as “panel-level”, to meet rising demand for powerful AI chips  —  TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach …

Posted from: this blog via Microsoft Power Automate.

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