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TSMC's US investment is a win-win; dropping one advanced node protects its interests, while an advanced packaging plant and R&D center boost US chip prowess (Ming-Chi Kuo)

Ming-Chi Kuo : TSMC's US investment is a win-win; dropping one advanced node protects its interests, while an advanced packaging plan...

3 March 2025

Sources: Nvidia and Broadcom are running 18A manufacturing tests with Intel, and AMD is also evaluating whether Intel's 18A process is suitable for its needs (Reuters)

Reuters:
Sources: Nvidia and Broadcom are running 18A manufacturing tests with Intel, and AMD is also evaluating whether Intel's 18A process is suitable for its needs  —  Chip designers Nvidia (NVDA.O) and Broadcom (AVGO.O) are running manufacturing tests with Intel (INTC.O), two sources familiar …

Posted from: this blog via Microsoft Power Automate.

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