TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun — Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.
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Tencent releases Hy3-preview, its first AI model developed under former OpenAI researcher Yao Shunyu; the model features 295B parameters, down from HY2's 400B — The model is relatively small with only 295 billion parameters, bucking a recent trend of large models with trillions of parameters
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Around 30K attend a Samsung union rally demanding 15% of operating profits for chip division staff amid the AI boom; the demand totals $27B or $400K+ per worker — Tens of thousands of people gathered outside Samsung Electronics Co.'s main chip hub to demand employees get a greater share of profits reaped from the AI boom.
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Sensor Tower: India's mobile app IAP revenue crossed $300M in Q1, up 33% YoY, with non-gaming apps generating $200M+, much of it captured by global platforms — India's mobile app market is generating record revenue, with in-app purchases crossing $300 million in the first quarter …
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SpaceX's S-1 excerpts list “manufacturing our own GPUs” among the “substantial capital expenditures” it is undertaking, with the size of the expenditure TBD — SpaceX may be tackling one of the biggest challenges in the chip business: manufacturing the keys …
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